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Overview

Industry

Papers

Efficere Technologies is a company founded on signal integrity principles. We have developed a core competency of signal integrity expertise based on accurate three-dimensional modeling of physical structures and rigorous analysis of electromagnetic field solver results in order to improve the signal integrity of systems interconnect, whether in the IC package, printed circuit board (PCB), connectors, or elsewhere. We are applying the lessons learned in doing so to a series of high-performance products, including specialized test adapters and cables.

We design significant safeguards into our products such that speeding up the system does not break the design. This unique combination of methodology, techniques, and intellectual property, Efficere's 3DA Signal Integrity Tools & Technology, reduces science to practice and delivers products with unmatched performance levels to our customers. As a result, Efficere's proprietary and patented technologies, such as the electrically Invisible Via™, offer a distinct advantage over other methods used to develop high-speed interconnect, creating nearly perfect electrical signal paths using standard manufacturing processes and existing materials.



INDUSTRY ORGANIZATIONS & STANDARDS 

Because Efficere wants to make the best quality products possible, we firmly believe in working with industry organizations and adhering to standards wherever possible.

IEEE

A non-profit, technical profession association serving public interest and technical members in all areas of electrical and electronics engineering. The IEEE 802.3 working group develops standards for Ethernet based LANs. Efficere participates on the IEEE 802.3 Higher Speed Study Group.


HDMI

Comprised of Hitachi, Panasonic, Philips, Silicon Image, Sony, Thomson, and Toshiba, the High-Definition Multimedia Interface (HDMI) Founders have joined together to define a next-generation digital interface specification for consumer electronics products. HDMI adopters and supporters include satellite and cable companies, major motion picture producers, and Efficere, among others.


AeA

Founded in 1943, the AeA (formerly the American Electronics Association) is the nation's largest technology trade association with over 2,500 member companies representing all segments of the high-tech industry. Efficere has been an AeA member since December 2005.


SFP

Originally defined in 2001 under a multi-source agreement (MSA) by fifteen module manufacturers, small formfactor pluggable (SFP) modules support Fibre Channel and Gigabit Ethernet applications with data rates between 1 Gbps and 4 Gbps (with a roadmap up to 8 Gbps). The SFP spec (INF-7084) is maintained by the SFF Committee.

TECHNICAL PAPERS 

An assortment of technical papers and presentations about Efficere technologies and processes.

100G Ethernet Test Adapter. Presentation for IEEE 802.3 Higher Speed Study Group, March 2007.

Next Generation 20Gbps Interconnects. Presented by Efficere, IBM, and Agilent at DesignCon, January 2007. The increased emphasis on high-performance serial data lines as the primary means of moving data through datacom and telecommunications systems presents new challenges for digital design engineers. Backplanes, cabling between boards and systems, circuit boards, and high-speed chip packages require an ever-increasing sophistication in the tools, methods, and techniques used in product design, characterization, and production test. Establishing an accurate measurement at 20 Gbps and higher requires a test environment that can precisely measure and extract data at microwave frequencies. This paper uses a novel test fixture design to demonstrate solutions to the calibration, de-embedding, and measurement techniques necessary to achieve accurate test results.

Efficere Technologies Develops World Class Test Fixtures. Agilent success story, November, 2006. Efficere CTO Will Miller talks about his experience using Agilent's 50GHz VNA, test setup and Physical Layer Test System (PLTS) software to extract S-parameters, which were exported to advanced modeling and simulation tools in the design of a test adapter.